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One free scan finds every outdated or missing driver and matches the right update for your exact hardware.Free scan · exact hardware matchIntelova prijava patenta opisuje način da se optičke komponente precizno povežu sa talasovodima, ali ne znači da današnji procesori obrađuju podatke svetlošću unutar svojih jezgara. Reč je o predlogu za optičko povezivanje oko procesorskog pakovanja. Zasebno od tog patenta, Intel je 2024. demonstrirao optički I/O čiplet spakovan uz CPU.
Šta je Intel zapravo patentirao?
Intelova američka prijava US20250291127A1, „Optical interconnects and related methods“, podneta je 15. marta 2024. i objavljena 18. septembra 2025. Google Patents je označava kao prijavu u postupku, uz upozorenje da je njen prikaz statusa zasnovan na pretpostavci i nije pravno mišljenje.
Opis se usredsređuje na spajanje nosača talasovoda sa nosačem optičkih komponenti povezanih sa fotonskim integrisanim kolom (PIC). Talasovod usmerava svetlosni signal između emitera i detektora. Oblikovane, zakošene površine na nosačima pomažu da se komponente poravnaju pri sklapanju. Patent navodi da odstupanje veće od jednog mikrometra može značajno da pogorša integritet signala; to je objašnjenje izazova preciznog spajanja, a ne specifikacija procesora.
Drugim rečima, naslov o „svetlosti kroz čip“ može da zvuči kao da će svetlost zameniti električne signale unutar CPU jezgara. To ne proizlazi iz ove prijave. Ona opisuje optičku vezu komponenti oko procesorskog pakovanja, a ne svetlosno izvršavanje instrukcija u jezgrima.
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Patent, demonstracija i proizvodi su tri različite stvari
Patentna prijava pokazuje dizajn koji Intel želi da zaštiti, ali sama po sebi ne potvrđuje da se taj dizajn koristi u proizvodu. Ni Intelova demonstracija optičkog I/O čipleta iz 2024. ne dokazuje da je korišćeno baš rešenje iz prijave US20250291127A1.
| Nivo | Šta je poznato | Šta to ne potvrđuje |
|---|---|---|
| Patentna prijava | Predlog sklopa za poravnavanje talasovodnih i optičkih komponenti. | Da je dizajn ugrađen u komercijalni CPU. |
| Demonstracija iz 2024. | Intel je prikazao OCI čiplet u zajedničkom pakovanju sa CPU-om i optičku vezu između dve CPU platforme. | Da je demonstracija koristila patentirani sklop ili da se već prodaje kao standardni potrošački procesor. |
| Postojeća fotonska ponuda | Intel navodi fotonske komponente i pluggable primopredajnike za data-centre. | Da se te isporuke odnose na novi OCI čiplet ili na kućne računare. |
Šta je Intel demonstrirao 2024. godine?
Na konferenciji Optical Fiber Communication Conference (OFC) 2024. Intel je predstavio potpuno integrisani Optical Compute Interconnect (OCI) čiplet, zapakovan zajedno sa Intel CPU-om i pokrenut sa živim podacima. Optička veza povezivala je dve CPU platforme preko jednomodnog optičkog vlakna. Intelov opis govori o optičkom I/O između računarskih platformi, a ne o zameni elektronskih veza unutar CPU jezgara.
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Prema Intelovoj objavi o demonstraciji, konfiguracija podržava do 64 kanala po 32 Gbit/s u svakom smeru, ukupno do 4 Tbit/s dvosmerno. Intel opisuje osam parova vlakana, od kojih svaki prenosi osam talasnih dužina. Veza je projektovana za vlakno dužine do 100 m, tačiau Intel napominje da bi praktično korišćenje zbog kašnjenja usled vremena putovanja moglo biti ograničeno na desetine metara.
Intel je za demonstrirano rešenje sa optikom u zajedničkom pakovanju naveo 5 pJ po bitu, naspram približno 15 pJ/bit za pluggable optičke primopredajnike. To je Intelovo poređenje konkretnih rešenja u okviru te demonstracije, a ne nezavisno merenje niti univerzalno poređenje optike sa svim električnim vezama.
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Kako se ovo uklapa u Intelovu fotonsku ponudu?
Intelova stranica o Silicon Photonics predstavlja OCI kao novu klasu optičke povezivosti za buduće računarske platforme. Prva generacija čipleta podržava 4 Tbit/s dvosmerno, a Intel navodi razvojni plan ka desetinama terabita u sekundi po uređaju. Čiplet je projektovan za zajedničko pakovanje sa budućim CPU-ima, GPU-ima, IPU-ima i drugim SoC-ovima. Intel kaže da radi preko standardnog jednomodnog vlakna SMF-28 i da ne zahteva vlakno koje čuva polarizaciju.
Ta OCI tehnologija nije isto što i Intelova postojeća šira Silicon Photonics platforma za pluggable primopredajnike u data-centrima. Intel navodi više od 8 miliona isporučenih PIC-ova i više od 32 miliona lasera integrisanih na čipu za tu širu platformu. Kompanija kaže da su njene komponente ugrađene u pluggable module koje koriste veliki cloud provajderi. Te brojke nisu broj isporučenih OCI čipleta.
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Intel takođe navodi da trenutno nudi pet od šest integrisanih kola potrebnih za dizajn pluggable primopredajnog modula: TX PIC, RX PIC, drajver, prijemnik (TIA) i kontroler (PMIC). To pokazuje postojeću ponudu fotonskih komponenti, ali ne znači da se optičke veze iz OCI demonstracije prodaju kao potrošački procesori.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Postoji li još jedan Intelov patent o fotonskom pakovanju?
Da. Zasebna prijava US20250020874A1, objavljena 16. januara 2025, opisuje fotonski osnovni čip sa optičkim interfejsom sa donje strane, električnim priključcima sa gornje i SoC-om naslaganim na vrhu. To je drugi patentni dokument; ne treba ga mešati sa prijavom US20250291127A1 niti pretpostaviti da je upravo on bio predmet vesti o optičkim konekcijama.
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Kada bi se optički I/O mogao pojaviti u proizvodima?
Intel govori o projektovanju OCI čipleta za buduće računarske platforme, ali izvori ne navode potvrđen datum komercijalne isporuke. Zato se demonstracija i razvojni plan ne mogu čitati kao najava konkretnog roka za kupovinu. Nema ni osnova da se patent tumači kao mogućnost da se tehnologija naknadno doda običnom kućnom CPU-u.
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